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Solder Preforms
SOLDER PREFORMS
Lead-free Solder Preforms

At present, there are many kinds of lead-free solders with ever-changing alloys. The alloy composition includes binary system, ternary system and polynary system.??

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Generally, most of them are composed of Sn, with appropriate addition of Ag, Zn, Cu, Sb, Bi, In and other metallic elements. With the different alloys, the properties of solders can be optimized, then to get an ideal mechanical, electrical and thermal properties.?

PRODUCT SELECTION
DETAILED INTRODUCTION
PRODUCT LIST

產品特性與優勢

·??Good Mechanical Properties

·? Superior electrical conductivity

·? High thermal conductivity

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Typical Products

Sn-Ag-Cu Preforms

Sn-Ag-Cu (SAC) is the most common alloy in soldering electronics. Such as those alloys whose melting point is around 217℃, like SAC105(Sn98.5Ag1Cu0.5), SAC305 (Sn96.5Ag3Cu0.5)、SAC387(Sn95.5Ag3.8Cu0.7) and SAC405(Sn95.5Ag4Cu0.5) are usually used in reflow, wave and manual soldering.?

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Among above, SAC305 are more wildly used. Compared with Sn63Pb37, it has better performance on stiffness, tensile strength, yield strength, shear strength, impact strength and creep strength;? compared with Sn-Cu/Sn-Ag preforms, it’s wetting properties are better.

PRODUCT LIST
Solid Line
°C
Liquidus
Eutectic Alloy
Density
g/cm3
Resistivity
μΩ.m
Thermal Conductivity
W/m.K
Thermal Expansion Coefficient
10-6/℃
Tensile Strength
Mpa
/ / 138 8.56 0.383 19 15 55.16
138 140 / 8.57 / / / /
217 227 / 7.32 0.133 60 / 40
217 218 / 7.37 0.132 58 21 50
217 220 / 7.4 0.132 57 22 48
217 220 / 7.4 0.132 62 / 51.5
217 218 / / / / / /
/ 221 / 7.37 0.108 33 30 39
221 240 / 7.4 0.137 / 23 55.2
217 220 / / / / / /
217 227 / / / / / /
235 240 / 7.25 0.145 28 31 40.7
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