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Solder Paste
SOLDER PASTE
Micron Solder Powder
PRODUCT SELECTION
DETAILED INTRODUCTION
PRODUCT LIST
Features and Benefits
· Applied to 0.3mm picth bonding pad.
· Type 5 solder powder (10～25 µm) can be used for 0402 components soldering.
· Excellent printability.
· Good heat-resistance and wetting properties.
Applications
Smartphone, Smartwatch.